Sr Principal Sourcing Manager – Silicon Technologies

About this role

Astera Labs (NASDAQ: ALAB) provides rack-scale AI infrastructure through purpose-built connectivity solutions. By collaborating with hyperscalers and ecosystem partners, Astera Labs enables organizations to unlock the full potential of modern AI. Astera Labs’ Intelligent Connectivity Platform integrates CXL®, Ethernet, NVLink, PCIe®, and UALink™ semiconductor-based technologies with the company’s COSMOS software suite to unify diverse components into cohesive, flexible systems that deliver end-to-end scale-up, and scale-out connectivity. The company’s custom connectivity solutions business complements its standards-based portfolio, enabling customers to deploy tailored architectures to meet their unique infrastructure requirements. Discover more at www.asteralabs.com.

Role Overview

Astera Labs is seeking a highly experienced Sr. Principal – Technical Category Sourcing Manager – OSAT & Substrate to set and drive global sourcing strategy in partnership with Engineering—owning supplier selection, commercial negotiations, and product cost models across our outsourced semiconductor assembly and test (OSAT), advanced packaging, and package substrate supply base.

This role owns the end-to-end commercial relationship with OSAT partners, substrate suppliers, and their sub-tier raw material sources—from sourcing strategy and RFQ through pricing, contracting, capacity assurance, and cost roadmaps—across advanced packaging platforms including flip-chip BGA, 2.5D/3D integration, chiplet-based multi-chip packages, and high-layer-count ABF substrates.

This is a highly cross-functional role working closely with Package Engineering, Test Engineering, Operations, Quality, Finance, and Legal to secure capacity, qualify new suppliers, and deliver cost and supply-continuity commitments through NPI and high-volume production.

A core focus of this role is staying ahead of the technology pipeline: as our silicon moves to advanced process nodes and increasingly complex multi-chip packages, you will secure the assembly, test, and substrate capability—and the sub-tier raw materials behind it—well before those platforms reach production.

Success in this role requires a strong balance of technical acumen, business savvy, and the ability to execute against strategic objectives—translating engineering requirements into sourcing decisions, and sourcing strategy into measurable cost, capacity, and continuity outcomes.

A Day in the Life

In this role, you will:

• Set and drive global sourcing strategy for OSAT, advanced packaging, and substrates in partnership with Engineering

• Lead RFQs, pricing negotiations, and commercial agreements with OSAT and substrate partners

• Secure capacity, tooling, and NRE commitments ahead of demand inflection points

• Build and maintain product cost models and defend annual cost-reduction roadmaps

• Qualify and develop second-source suppliers to de-risk single-source packages

• Partner with Package and Test Engineering to source emerging advanced packaging and multi-chip package technologies

• Map the advanced packaging and advanced process node roadmap to supplier capability and capacity gaps

• Engage sub-tier substrate suppliers to secure ABF film, copper foil, and other critical raw materials

• Negotiate LTAs, capacity reservation agreements, and pricing structures alongside Legal and Finance

• Drive supplier business reviews, scorecards, and escalation of commercial and supply issues

Key Responsibilities

Category Strategy & Supplier Selection

• Set and drive the global sourcing strategy for OSAT services (assembly, test) and package substrates (ABF, BT, organic interposer) in partnership with Package and Test Engineering

• Build alignment with Engineering, Operations, and Finance on category strategy and execute against multi-year strategic objectives

• Segment the supply base and define single-, dual-, and multi-source strategies by package family and technology node

• Lead supplier selection, RFI/RFQ, and award decisions in partnership with Package and Test Engineering

• Benchmark the OSAT and substrate landscape, tracking technology roadmaps, capacity additions, and regional footprint

Advanced Packaging & Emerging Technology Sourcing

• Partner with Package Engineering to source emerging advanced packaging platforms, including 2.5D/3D integration, chiplet-based multi-chip packages, and high-density organic and silicon interposers

• Translate the product roadmap at advanced process nodes into assembly, test, and substrate capability requirements and sourcing plans

• Identify and qualify suppliers with the technology roadmap, equipment, and capacity to support next-generation package architectures

• Negotiate development, prototype, and qualification terms for pre-production advanced packaging technologies, including NRE, tooling, and test development

Commercial Negotiation & Contracting

• Lead pricing, tooling, NRE, and capacity negotiations with OSAT and substrate suppliers

• Negotiate and manage MSAs, LTAs, capacity reservation agreements, and pricing addenda with Legal and Finance

• Structure commercial terms covering yield, scrap, material liability, lead time, and cost-down commitments

• Serve as the primary commercial point of contact and escalation path for assigned suppliers

Product Cost Modeling & Cost Management

• Build and maintain product cost models spanning substrate, assembly, test, and yield, and keep them current as designs, nodes, and supplier pricing evolve

• Maintain should-cost and total-cost-of-ownership models for assembly, test, and substrate to benchmark supplier quotes and award decisions

• Develop and deliver annual cost-reduction roadmaps tied to yield, test time, panel utilization, and design-for-cost initiatives

• Partner with Finance on standard cost, purchase price variance, cost forecasting, and budget planning

• Drive cost transparency across substrate layer count, body size, test insertions, and key material…