Senior PCB Layout Engineer High-Density Multi-Layer / Cadence

About this role

Intro: Looking for a Senior PCB Layout Engineer in Kuala Lumpur. Take charge of complex high-density, multi-layer board designs using Cadence layout tools. Must have strong experience with high-speed digital buses and RF paths. 3-day hybrid work setup.

Why you should apply -The Ultimate Engineering Puzzle: Route multi-layer boards matching high-speed digital buses with sensitive RF paths. -True Architectural Partner: Escape basic layouts where trace routing constraints do not matter. -Schematic to Reality: Shape the signal and power paths that turn high-frequency designs into physical products.

About you -Experience as: PCB Layout Designer, Printed Circuit Board Specialist, CAD Layout Engineer, or Hardware Mask Design Engineer. -Level: Mid to senior layout engineering roles (5–8 years of experience).

Project / Client: A premier, iconic global telecommunications pioneer renowned for shaping carrier-grade mobile networks and setting the benchmark for international connectivity standards.

What you will do -Execute intricate multi-layer PCB layouts for analog, digital, and RF circuits. -Build and standardize global schematic symbols and precise footprint packages. -Implement layout constraints for strict impedance control and EMI mitigation. -Generate full fabrication packages and resolve queries directly with PCB factories.

Experience you need -5+ years of dedicated, high-density multi-layer PCB layout experience. -Expert-level daily utilization of Cadence layout tools, AutoCAD, and CAM350. -Deep knowledge of multi-layer stackup design, DFM, and DFA manufacturing rules.

Work Arrangement / Benefits: -Hybrid: 3 days a week in office / 2 days home. -KL City (LRT / KTM accessible) -Contract: 2-year extendable contract.