Product Engineer, Product Operations Engineer

About this role

About the Role

We are seeking a Product Engineer / Product Operations Engineer to serve as the critical link between design, test, manufacturing, and the customer, and to help stand up the product-engineering / product-operations function from the ground up. In this role you will own products from first silicon through qualification, ramp, and sustaining—driving yield, test quality, cost, and supply to ensure our multi-die devices ship on time, at the volumes datacenter silicon demands, and at target margin. You will partner with DFT, design, and test engineering, and help establish the foundry/OSAT and operations relationships needed to take products from bring-up through ramp and sustaining for advanced-packaging datacenter silicon.

What you'll do

•
Own assigned products across the full lifecycle: new product introduction (NPI), characterization, qualification, ramp, and sustaining

•
Drive yield analysis and improvement—monitor wafer sort and final test yield, lead failure analysis and root-cause efforts, and partner with design/test to close gaps

•
Own the multi-die yield story—known-good-die (KGD) sorting, die-matching and binning across a package, assembly and packaging yield, and cost-per-package risk (a single marginal die can sink an entire multi-die assembly)

•
Manage test program quality and optimization across wafer sort, final test, and system-level test (SLT)—test time reduction, coverage vs. cost trade-offs, guardbands, and outlier/screening strategies (PAT/SBL/SYL) used to screen marginal die for KGD

•
Lead silicon characterization across PVT corners; define spec limits, shmoo analysis, and datasheet correlation

•
Own product qualification (HTOL, HAST, TC, ESD/latch-up, etc.) and reliability sign-off in line with JEDEC standards as applicable

•
Establish and drive production operations: lot dispositioning, capacity and WIP management, binning/grading strategy, and coordination with foundry and OSAT (assembly/test) partners

•
Monitor and act on production data—SPC, yield dashboards, and statistical analysis (JMP/Python) to detect excursions and drive corrective action

•
Lead excursion management and 8D/CAPA—contain, root-cause, and resolve manufacturing and quality issues; establish customer-return (RMA/FA) handling

•
Drive cost reduction and continuous improvement—test time, yield, package, and material cost initiatives

•
Help establish customer-quality processes—field issue resolution, quality reporting, and audits

What we're looking for:

•
Bachelor's or Master's in Electrical Engineering, Materials/Semiconductor Engineering, or related field

•
Hands-on experience in semiconductor product engineering, test engineering, or operations for complex digital/SoC/ASIC products

•
Strong understanding of the semiconductor manufacturing flow—wafer fab, wafer sort, assembly, and final test

•
Multi-die / advanced-package product engineering—known-good-die (KGD) sorting, die-to-package matching and binning, assembly and packaging yield, and cost-per-package management

•
Experience with foundry and OSAT relationships and offshore test/assembly operations

•
Experience with ATE platforms (Advantest, Teradyne) and test program development, debug, and optimization, including system-level test (SLT)

•
Solid grounding in yield analysis, statistics, and data analysis—SPC, distributions, correlation; proficiency with JMP, Python, or equivalent

•
Experience with silicon characterization (PVT corners, shmoo, spec setting) and datasheet correlation

•
Working knowledge of product qualification and reliability methodologies (JEDEC).

•
Familiarity with DFT/test concepts—scan, MBIST, ATPG patterns, boundary scan—and how they map to production test

•
Knowledge of outlier screening methods (PAT/SBL/SYL) applied to known-good-die (KGD) screening—identifying marginal die before they are committed to an expensive multi-die package

•
Experience with NPI program management and product ramp/sustaining for advanced-packaging datacenter silicon

•
Familiarity with multi-die package technologies and assembly processes.

•
Structured problem-solving / continuous-improvement methodology (8D, CAPA, DOE, or equivalent)

•
Strong cross-functional collaboration skills and the ability to drive issues to closure across design, test, fab, and OSAT partners

Compensation

Final offers depend on level,…