Mechanical Engineering Intern M/F

À propos du poste

Alice & Bob is developing the first universal, fault-tolerant quantum computer to solve the world’s hardest problems.
The quantum computer we envision building is based on a new kind of superconducting qubit: the Schrödinger cat qubit 🐈‍⬛. In comparison to other superconducting platforms, cat qubits have the astonishing ability to implement quantum error correction autonomously!

We're a diverse team of 250+ brilliant minds from over 35 countries united by a single goal: to revolutionise computing with a practical fault-tolerant quantum machine. Are you ready to take on unprecedented challenges and contribute to revolutionising technology? Join us, and let's shape the future of quantum computing together!

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• Characterize the current readout chain and define the specification

• Map the existing chain: assembly time, defect rate, insertion losses, footprint

• Define the specification with the operation and RF teams: number of lines (target 32), MXC envelope, insertion loss budget, thermalization requirements

• Study and select the mechanical architecture

• Compare two architectures: a pre-cabled block with non-threaded connections, and a block with a single plug interface to the MXC

• Benchmark compact components available on the market

• Build a decision matrix and defend the chosen architecture in design review

• Design the readout module

• Produce the CAD model, drawings and a costed bill of materials (BOM)

• Select materials and design thermalization to the MXC plate

• Define torque specifications and perform the SMP tolerance stack-up

• Choose connectors compatible with a future board-edge/PCB integration

• Write an assembly and inspection procedure that a subcontractor can follow

• Build and validate a prototype in the cryostat

• Assemble the prototype and measure the real assembly time

• Perform SOLT/SOLR calibration and S-parameter characterization at room temperature and cold

• Compare performance against the SMA reference chain and write a measurement report

• Recommend the path to industrialization

• Deliver a go/no-go recommendation based on measurement results

• Build an industrialization roadmap, including inputs for the phase-2 PCB study Final-year Master's or engineering student in mechanical engineering or mechatronics, with an interest in RF and cryogenic hardware. Hands-on and rigorous, you enjoys building, testing and documenting hardware and is comfortable presenting technical choices to multidisciplinary teams.

• Mechanical design for assembly (DFA) and tolerance analysis (stack-ups)

• Proficiency in CAD (SolidWorks) and technical drawing

• Material selection and thermal design, ideally with an interest in cryogenic constraints

• Basic knowledge of RF connectors and coaxial lines (a plus)

• Interest in RF measurements (VNA, S-parameters) and cryogenics

• Hands-on approach: comfortable assembling and testing hardware

• Rigor and clear technical documentation

• Ability to structure and present technical choices in a design review

• LANGUAGES: Proficient in English

• EXPERIENCE: No minimum required. A previous internship or project in mechanical design, prototyping or testing is a plus. Availability: 6 months.