Failure Analysis Engineer

About this role

Position: PHYSICAL FAILURE ANALYSIS ENGINEER

Location: COVINGTON, GA

JOB SUMMARY

Responsible for performing physical failure analysis of glass substrates. This includes using a variety of techniques, such as microscopy, spectroscopy, and metallurgy to identify the root cause of failures. The ideal candidate will have a strong background in electrical engineering and be able to work independently and as part of a team.

DUTIES/RESPONSIBILITIES:

• Investigate physical failures and defects including delamination, cracks, and voids using advanced microscopy and analytical techniques

• Prepare samples for analysis, including cutting, polishing, and coating, while ensuring preservation of relevant features

• Use optical microscopes, electron microscopes, and other imaging tools to examine samples at various scales

• Analyze images to identify defects, fractures, corrosion, and other anomalies

• Analyze data collected from various analyses to develop comprehensive understanding of failure mechanisms

• Generate detailed reports outlining findings, analysis methodologies, and recommendations

• Utilize spectroscopic methods to identify material compositions and elemental distributions

• Perform mechanical and thermal testing

• Prepare reports and documentation of failure analysis results

• Work with other engineers and scientists to develop and improve the failure analysis process

• Participate in quality control procedures, including instrument calibration and performance check

• Troubleshoot technical issues

• Provide support to the OQA function with analysis results

REQUIREMENTS:

• Experiences on SEM / FIB equipments (Analysis tools)

• Proficiency in operating microscopy equipment (optical, SEM, FIB, TEM) and analytical tools (FTIR, EDX)

• Excellent analytical and problem-solving skills to identify root cause of failures

• Strong attention to detail and ability to accurately document findings and observations

• Excellent communication skills and a proven ability to juggle multiple high priority tasks

QUALITIFICATIONS:

• Strong knowledge of electronic devices and their failure mechanisms

• Experience with a variety of failure analysis techniques

• Proficiency in microscopy techniques, material analysis, and spectropy

• Strong understanding of material properties, fracture mechanics, and root cause analysis

• Proficiency in operating microscopy equipment (optical, SEM, TEM) and analytical tools (FTIR, EDX)

EDUCATION:

• Bachelor’s degree in material science, electrical engineering, or related field

EXPERIENCE:

• 0+ years of experience in physical failure analysis in electronic or semiconductor applications

• Experience in a Manufacturing Environment

SALARY:

• $70,000 - $115,000