Die Attach Manufacturing Engineer- Process & Equiment

About this role

ABOUT LUMILENS

At Lumilens, we are building the critical photonics infrastructure powering tomorrow’s AI supercomputing. Our mission is to unlock a new era of computing that is faster, cooler, and massively more efficient. Join our world-class team as we redefine possibilities in photonic technology.

JOB DESCRIPTION

We are seeking a Die Attach Manufacturing Engineer – Process & Equipment (Silicon Photonics / PIC Packaging) to join our Manufacturing Engineering team within Photonic Packaging & Assembly. In this mid-to-senior level role, you will lead the development, qualification, optimization, and sustaining of die attach processes and equipment for Photonic Integrated Circuits (PICs), silicon photonics dies, and co-packaged optical/electronic modules. This position is responsible for achieving sub-micron placement accuracy and optical-grade attach quality through active/passive alignment die bonding, epoxy/adhesive dispense, eutectic/AuSn solder attach, and flip-chip bonding. You will ensure high optical coupling yield, mechanical/thermal reliability, and operational throughput, while supporting New Product Introduction (NPI) for emerging photonic packages and modules.

KEY RESPONSIBILITIES

PROCESS ENGINEERING

- Develop, characterize, qualify, and optimize die attach processes for PIC/silicon photonics dies, laser dies, and EIC-PIC hybrid assemblies, including active/passive alignment epoxy attach, AuSn/eutectic solder attach, and flip-chip bonding.

- Establish and maintain process specifications, work instructions, control plans, and process windows (DOE-based) for sub-micron and low-single-digit-micron placement accuracy.

- Lead root cause analysis and implement corrective/preventive actions (CAPA) for die attach-related yield loss and photonics-specific defects (e.g., optical misalignment, coupling loss, epoxy outgassing, die tilt, voids, bond-line thickness control).

- Support NPI by developing die attach process flows for new photonic packages, transceiver modules, and hybrid/co-packaged integration platforms.

- Monitor SPC/process capability (Cpk) data on placement accuracy, bond-line thickness, and optical coupling efficiency. Drive process improvements to reduce variation and coupling loss.

- Evaluate and qualify optically-compatible die attach materials (low-outgassing/UV-cure epoxies, index-matched adhesives, AuSn solder) with Materials and Optical Design Engineering.

- Partner with Quality, Reliability, and Product/Optical Engineering on failure analysis and reliability testing (thermal cycling, humidity, optical power/coupling loss, hermeticity, shear/pull testing, X-ray/CSAM/SAT inspection).

- Support development of active alignment processes with real-time optical feedback during die bonding.

EQUIPMENT ENGINEERING

- Own equipment performance, uptime, and OEE for photonics die attach tools (high-precision active/passive alignment die bonders, sub-micron pick-and-place, epoxy dispense, AuSn/eutectic die bonders, UV-cure stations, fiber/waveguide alignment).

- Lead equipment installation, qualification (IQ/OQ/PQ), and ramp-up for new/upgraded photonic die bonding and alignment tools, including vision systems and sub-micron motion stages.

- Maintain and execute preventive maintenance plans, troubleshoot high-precision optical/mechanical equipment (stage drift, calibration, repeatability), and minimize downtime.

- Work with specialized vendors (Besi, Palomar Technologies, Finetech, Set North America, PI/Physik Instrumente, or similar) for tool upgrades, retrofits, spare parts, and technical escalations.

- Drive automation, tooling, and fixture improvements for throughput and repeatability while maintaining alignment tolerances and protecting optical facets/lenses.

- Support equipment capacity planning and capital equipment (CAPEX) proposals.

CROSS-FUNCTIONAL COLLABORATION

- Collaborate with Design, Product, Quality, and Operations teams to align die attach process capability with product requirements.

- Provide technical training and guidance to manufacturing technicians and operators.

- Support process/equipment documentation for internal and customer audits.

- Track and report KPIs: yield, Cpk, equipment uptime, scrap rate, and cycle time.

- Engage in cost reduction, lean manufacturing, and Six Sigma/continuous improvement initiatives.

REQUIREMENTS

REQUIRED

- Bachelor’s degree in Electrical, Mechanical, Materials, Optical/Photonics Engineering, or related field (Master's preferred for senior roles)

- 3–7 years of hands-on experience in silicon photonics/PIC industry, focusing on die attach process/equipment engineering for optical or opto-electronic packaging

- Direct experience with silicon photonics dies and/or III-V laser dies including wafer/die handling, dicing, facet protection, and optically sensitive die placement

- Working knowledge of die attach materials/methods for photonics (low-outgassing/optical-grade epoxies, UV-cure adhesives, AuSn/eutectic solder attach, flip-chip bonding) and failure modes (coupling loss, epoxy haze, bond-line drift, facet damage)

- Experience with high-precision die/fiber attach equipment (Besi, Palomar Technologies, Finetech, Set North America, PI/Physik Instrumente, or equivalent)

- Familiarity with DOE, SPC, Cpk analysis, and structured problem-solving (8D, 5-Why, Fishbone) for optical coupling yield and alignment accuracy

- Understanding of photonic packaging architectures (transceiver modules, co-packaged optics/CPO, hybrid/heterogeneous integration) and their die attach/alignment needs

- Strong analytical, troubleshooting, and data-driven decision-making skills at sub-micron/micron-level tolerances

- Ability to read/interpret optical/mechanical engineering drawings, specs, and manuals

PREFERRED

- Experience in high-volume silicon photonics, optical transceiver, or PIC foundry/packaging house

- Exposure to active alignment and optical…